| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a circuit substrate based on the connection using a conductive projection, and to provide a circuit substrate base material suitable for it. SOLUTION: This is a manufacturing method for a circuit substrate that uses a nickel layer 1 multi-layered with a copper layer 2 as a resist layer, forms a conductive projection 7 by etching the copper layer, forms a metal foil provided at its top end with a conductive projection having a nickel layer, forms an insulating resinous layer 9 on that surface of this metal foil that has the conductive projection, and applies a selective nickel etching to remove the nickel layer and the insulating resinous layer at the top of the conductive projection, thus exposing the top part of the conductive projection. Here, the conductive projection may be formed by copper plating using a resist layer 24. In a circuit substrate base material on which a plurality of circuit layers are formed by laminating other circuit components and the like on the top of the circuit base material for this manufacturing method that is laminated with the metal foil having the conductive projection and the insulating resinous layer, the metal foil having the conductive projection has a selectively etchable resist layer at the top of the conductive projection. COPYRIGHT: (C)2006,JPO&NCIPI |
