| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of irregularities at a via conductor part of a ceramic wiring board which is sintered by suppressing contraction characteristics in X-Y axis direction, allowing formation of a flat surface, resulting in suppressed occurrence of defective IC which is mounted. SOLUTION: The ceramic wiring board comprises an insulating substrate 2 where a plurality of insulating layers 2a-2e are laminated, a flat conductor pattern 3 formed on the surface and backside as well as inside the insulating substrate 2, a via conductor 4 in which a paste containing metal powder is so filled and sintered as to penetrate the insulating layers 2a-2e, and a plurality of electrode pads 6 that are flip chip mounted, surface mounted using a solder, or wire bonded to an electric element 5 on the surface of the insulating substrate 2. The via conductor 4 directly connected to the electrode pad 6a is connected to a flat conductor pattern 3b on the backside of the insulating substrate 2, with a part of the connection path being partially deviated from the vertical direction of the center of the connection pad 6a. COPYRIGHT: (C)2006,JPO&NCIPI |
