发明名称 METHOD FOR TRANSFERRING MOLDING MATERIAL AND SUBSTRATE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a new, highly reliable technique for manufacturing a substrate which can diminish the incidence of a structural defect due to the entrainment of air bubbles during forming a pattern of protuberances, upgrades the reliability and yield of a finished product, dispenses with an offline process such as vacuum defoaming, and achieve the improvement of production efficiency and process simplification, when the substrate with a pattern of protuberances is manufatured. SOLUTION: In this method for transferring a molding material, the recessed part 111 of an intaglio for filling is filled with a paste-like molding material 171, then an intaglio 141 for transfer with a specified groove pattern formed is partially brought into contact with the intaglio for filling, and the grooves of the intaglio 141 for transfer are filled with the molding material. After that, the molding material is transferred onto the substrate as a pattern of protuberances from the intaglio 141 for transfer. Also, a substrate structure is provided. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006035713(A) 申请公布日期 2006.02.09
申请号 JP20040221030 申请日期 2004.07.29
申请人 FUJITSU LTD;ADVANCED PDP DEVELOPMENT CORP 发明人 TOYODA OSAMU;INOUE KAZUNORI;TOKAI AKIRA
分类号 B41M1/10;B41F17/14;H01J9/02;H01J11/02;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01J11/36 主分类号 B41M1/10
代理机构 代理人
主权项
地址