发明名称 SPINDLE HOLE POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device capable of repolishing a tapered hole of a spindle in the installed state to a machine tool, thereby eliminating troublesome and time-taking inefficient work of diassembling the spindle from the machine and assembling it, to perform easy, convenient and efficient repolishing of the tapered hole of the spindle. SOLUTION: The portable spindle hole polishing device 1 is composed of a base frame 2 that can be installed at the machine tool S; a polishing mechanism 5 having a rotary polishing tool 23 capable of polishing the tapered hole of the spindle of the machine tool S; an attitude adjusting mechanism B capable of adjustably setting the attitude of the rotary polishing tool 23 to the base frame 2; and a moving mechanism 9 capable of moving the rotary polishing tool 23 in the state of its attitude to the base frame 2 being determined by the attitude adjusting mechanism B, in the direction of its rotation axis X. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006035371(A) 申请公布日期 2006.02.09
申请号 JP20040218936 申请日期 2004.07.27
申请人 SYSTEC AKAZAWA CO 发明人 AKAZAWA YOHEI
分类号 B24B5/36 主分类号 B24B5/36
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