| 摘要 |
Provided are a liquid processing method, a liquid processing device, and a recording medium for liquid processing, which can enhance the uniformity of a coating state of a processing liquid onto a substrate. Coating unit U1 includes a rotary holder (20) configured to rotate a wafer (W), a nozzle (32) configured to supply a processing liquid (R) to a surface (Wa) of the wafer (W), and a controller (60) configured to control a position of the nozzle (32) with respect to the wafer (W). A liquid processing method includes: starting the supply of the processing liquid (R) to the surface (Wa) of the wafer (W) at an eccentric position away from the center CL1 of rotation of the wafer (W) and moving the position on the wafer (W) to which the processing liquid (R) is supplied toward the center CL1 while rotating the wafer (W) at first rotational rate ω1; and after the position on the wafer (W) to which the processing liquid (R) is supplied has reached the center CL1 of rotation, rotating the wafer (W) at second rotational rate ω2 higher than the first rotational rate ω1, thereby allowing the processing liquid (R) to spread toward the outer circumference of the wafer (W). |
