| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an abrasive along with a polishing method, for efficient, fast, and even polishing and easy process control, relating to a CMP technology for planarizing an interlayer insulating film, BPSG film, insulating film for shallow-trench isolation. <P>SOLUTION: The CMP abrasive contains cerium oxide particles, dispersants, water-soluble polymers, and water. The water-soluble polymer uses at least persulfuric acid and its base as polymerization initiator, to contain a polymer, in which a monomer containing at least carboxylic acid having unsaturated double bonds or its base is polymerized. The mixing amount of the polymer of water-soluble polymer preferably is 0.01-5 pts.wt. with respect to CMP abrasive 100 pts.wt., and the weight-average molecular weight of the polymer is 200-50,000. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
