COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a composite substrate for a printed circuit board to keep the adhesiveness to a water-based electrically conductive ink and effectively prevent various problems caused by the lowering in the hydrophobicity of the substrate surface and provide a representative application technology of the substrate. SOLUTION: The composite substrate for the printed circuit board is surface-treated to lower the hydrophilicity of the surface after a drying stage to be lower than the hydrophilicity of the surface at the circuit-printing stage. The surface has good adhesiveness to the water-based conductive ink in printing to improve the transferability of the water-based conductive ink to the composite substrate for the printed circuit board and effectively prevent the occurrence of various problems caused by the lowering in the hydrophobicity of the substrate surface. Accordingly, the frequency of electric troubles such as circuit breaking is decreased in a board for printed circuit or an electric appliance part furnished with the composite substrate for the printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI