| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem, wherein slobbery stain of vapor barrier occurs on a process if applying the vapor barrier is not performed in a remaining one side, after the vapor barrier has been applied to a single side and fully dried, in the conventional electronic control devices. SOLUTION: A lead is bent so that the body of an electronic component 3 becomes parallel to a printed circuit board 1, the anchoring side of a heat dissipating plate 4 becomes a surface of reverse of the printed circuit board 1, and the lead is soldered on the printed circuit board 1. In the printed circuit board 1, a hole is formed at a part between a portion, in which the lead of the electronic component 3 is soldered on the printed circuit board 1 and the body of the electronic component 3. The heat dissipating plate 4 is made sufficiently large to cover the hole on the printed circuit board 1. The conductor side of the printed circuit board 1 is turned up, and the vapor barrier 2 is applied from the conductor side of the printed circuit board 1, so that the vapor barrier 2 flows also into the lead of the electronic component 3 from the hole formed on the printed circuit board 1; and the lead of the electronic component 3 can be simultaneously coated with the vapor barrier 2. COPYRIGHT: (C)2006,JPO&NCIPI
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