| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer sheet deformation preventive structure capable of suppressing variations in temperature conducted from a conveyance rail to the wafer sheet with places. SOLUTION: A cooling section is provided between the conveyance rail and wafer sheet. Between a bottom plate 12 and a top plate 13 of the cooling section, 1st to 6th partitions 21 to 26 which extend along the length of the conveyance rail are provided to form 1st to 6th circulation spaces 41 to 46 in the cooling section 11. The 2nd circulation space 42 is connected to the 5th circulation space 45 through a 1st fold part 52, and the 3rd circulation space 43 is connected to the 4th circulation space 44 through a 2nd fold part 56. The 5th circulation space 45 is connected to the 6th circulation space 46 through a 3rd fold part 62. Consequently, meandering external circulation path 71 and internal circulation path 72 are formed in the cooling part. COPYRIGHT: (C)2006,JPO&NCIPI
|
