| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus reducing a wafer carrying time from a carrier mounted with a wafer carried into the semiconductor manufacturing apparatus until the wafer is carried out of the apparatus after processing. SOLUTION: The semiconductor manufacturing apparatus carries a boat 8 supporting a semiconductor substrate 1 into a processing chamber 9, and applies a prescribed process to the semiconductor substrate 1 supported by the boat 8 in the processing chamber 9. The apparatus includes: a carrier carrying unit 4 for conducting giving/receiving of the carrier 2 with the semiconductor substrate 1 contained therein between an external carrying apparatus and the semiconductor manufacturing apparatus; a wafer mount carrier placing unit 7 for mounting the carrier 2 when the semiconductor substrate 1 contained in the carrier is given to/received from the boat 8; a carrier storage unit 5 for storing the carrier 2; and a selection means for selecting whether the carrier 2 mounted on the carrier carrying unit 4 is transferred to the wafer mount carrier placing unit 7 or transferred to the carrier storage unit 5. COPYRIGHT: (C)2006,JPO&NCIPI
|
