SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND TAPE FOR PROCESSING WAFER

摘要

A tape for processing wafer is provided with an adhesive agent layer (2) and a bonding agent layer (3) on a base material film (1). In a polishing process, a rear plane of a wafer circuit board (5) is polished, in a status where the tape is adhered on the wafer circuit board having a protruding metal electrode (4). In a dicing process, the wafer circuit board is separated into pieces. In a process of picking up the separated chips, the chip is picked up in a status where the bonding agent layer (3) is peeled from the base material film (1) and adhered to the chip.