发明名称 |
Verfahren zur Verminderung von Teilchen von einem elektrostatischen Halter |
摘要 |
A method for reducing particles from an electrostatic chuck, having the steps of: setting a wafer onto an attracting face of an electrostatic chuck, attracting the wafer onto the attracting face by applying a voltage to the electrostatic chuck, releasing stress due to a difference in heat expansion between the wafer and the electrostatic chuck by sliding the wafer relative to the attracting face before the wafer's temperature arrives at a saturated temperature, and increasing the wafer's temperature to a saturated temperature from its lower temperature than that of the attracting face. <IMAGE> |
申请公布号 |
DE69927439(D1) |
申请公布日期 |
2006.02.09 |
申请号 |
DE1999627439 |
申请日期 |
1999.07.05 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
NAGAO, MIE;USHIKOSHI, RYUSUKE;OHNO, MASASHI |
分类号 |
B23Q3/15;G03F7/20;H01L21/00;H01L21/027;H01L21/68;H01L21/683;H02N13/00 |
主分类号 |
B23Q3/15 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|