| 摘要 |
<P>PROBLEM TO BE SOLVED: To make a power module small-sized by simplifying signal wires by providing a relay substrate which integrates and distributes the signal wires between parallel-connected power semiconductor elements. <P>SOLUTION: The power module is equipped with positive-electrode side power semiconductor elements 20b and 20d, negative-electrode side semiconductor elements 20a and 20c, and negative-electrode conductor patterns 30a, 30b, and 30c to which other-side terminals of the negative-electrode side patterns 30a, 30b, and 30c are connected. The module is further equipped with one or more couples of unit modules which each apply a source voltage between a positive-electrode conductor pattern 40 and negative-electrode conductor patterns 30a, 30b, and 30c to lead a conversion output out of an intermediate potential conductor pattern 50; gate signal wires 106a, 106b, 107a, and 107b which supply a gate signal common to corresponding power semiconductor elements of respective unit modules; and relay substrates 10a to 10b which relay and distribute the common gate signal. The relay substrates is arranged at intermediate positions between corresponding power semiconductor elements of the respective unit modules. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
