| 摘要 |
PROBLEM TO BE SOLVED: To promote miniaturization of a high-frequency module and to achieve reduction in cost. SOLUTION: A recess is provided on the rear surface of a circuit board 2 of a high-frequency module 1 to form a cavity 5. A crystal vibrator chip 6 is housed in the cavity 5. An IC 3 to be mounted on the top surface of the circuit board 2 and the crystal vibrator chip 6 are positioned vertically, thereby realizing the miniaturization of the high-frequency module. COPYRIGHT: (C)2006,JPO&NCIPI
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