| 摘要 |
PROBLEM TO BE SOLVED: To suppress the increase of the number of times of inspection of a solder ball joint caused by the increase of the number of pins of a BGA package, to satisfactorily recognize the status of the solder ball joint, and to shorten an inspection time. SOLUTION: This inspection device of a semiconductor apparatus is provided with a light source 12 arranged at one side face of a BGA package 5 connected to the electrode 2 of a substrate 1, which irradiates the clearance of the joint of the solder ball 6 of the BGA package with a light beam 16 at the time of inspecting the joint of the solder ball 6 of the BGA package 5, and a light receiving element 13 arranged at the other side face of the BGA package 5 opposite to one side face, which receives the light beam 16. The clearance of the joint of the solder ball 6 is irradiated with the light beam 16 such as a laser, and the light beam 16 transmitted through the clearance is detected by the light receiving element 13 so that the joint status of the joint of the ball 6 such as short-circuit or position deviation can be recognized from the transmitted status of the light beam 16. COPYRIGHT: (C)2006,JPO&NCIPI
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