ELECTROLESS COPPER PLATING SOLUTION, AND ELECTROLESS COPPER PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless copper plating solution which can be processed simply at the time of disposal, and can sufficiently reduce the burden on the biological environment or the like. SOLUTION: In the electroless copper plating solution containing a reducing agent for reducing copper ions and depositing copper on a surface of an object to be plated which is immersed in a solution with copper ions eluted therein, alkaline electrolytic water obtained by electrolyzing aqueous solution with sodium ascorbate dissolved therein is used as the reducing agent. COPYRIGHT: (C)2006,JPO&NCIPI