| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which has a high melting point and satisfactory heat resistance, and whose characteristics such as wettability and thermal fatigue strength are improved, and which is not adversely affected by heat at the time of reflowing even in the case lead-free solder having a relatively high melting point is used as solder for the packaging of an electronic component to a board, and can be suitably used for die bonding or the like as joining at the inside of an electronic component. SOLUTION: The lead-free solder alloy has a composition comprising, by mass, >10 to 24.9% Cu and ≥5% Sb, and the balance Sn, and in which the content of Sn exceeds 70%. Together with Cu, prescribed quantity of one or more kinds of elements selected from the group consisting of Ag, Au and Pd can be contained therein. Further, the addition of Te is preferable, and the addition of P or Ge is preferable as well. COPYRIGHT: (C)2006,JPO&NCIPI |
