Method of analyzing a buried layer in a wafer with a semiconductor component such as a DRAM chip uses electromagnetic radiation to penetrate the wafer

摘要

A method of analyzing a buried layer (3) in a wafer with a semiconductor component comprises using electromagnetic radiation (9) that enters a recess (4) in the surface (2) and leaves through a second recess (5) after penetrating to a measuring section of the buried layer and is received (8) and evaluated. An independent claim is also included for a component, especially a semiconductor wafer, analyzed as above.