发明名称 |
HIGH DENSITY BONDING OF ELECTRICAL DEVICES |
摘要 |
A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip. |
申请公布号 |
CA2570640(A1) |
申请公布日期 |
2006.02.09 |
申请号 |
CA20052570640 |
申请日期 |
2005.06.20 |
申请人 |
AVERY DENNISON CORPORATION |
发明人 |
FORSTER, IAN J.;KIAN, KOUROCHE;MUNN, JASON;EDWARDS, DAVID N.;MEHRABI, REZA;WEAKLEY, THOMAS CRAIG |
分类号 |
H01L21/00;H01L21/30;H01L21/44;H01L21/46;H01L21/48;H01L21/50;H01L21/60;H01L21/603 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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