| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a plastic package base with a functional structure which is superior in low noise, high heat dissipation and the like. <P>SOLUTION: A first lead frame is prepared which includes a first pad 120 and first leads 110a acting as internal terminals connected to the first pad and is arranged around the first pad, and a second lead frame is prepared which includes the first pad of the first lead frame, a second pad 220, corresponding to each of the first leads, and second leads 210 acting as external terminals, then the first lead frame and the second lead frame, in which the first leads and the second leads and the first pad and the second pad should be connected in a mutually corresponding manner are bonded. An unwanted connected portion of the first lead frame is removed for the connected first and second lead frames, and a single combined body of the lead frame having electrical and physical functionalities is completed. A predetermined mold shaping is carried out for the combined body of the lead frame, to form a plastic shell 320. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
