发明名称 NICKEL PLATING BATH FOR BARREL PLATING AND BARREL PLATING METHOD USING THE BATH
摘要 PROBLEM TO BE SOLVED: To develop a plating bath where, at the time of applying barrel plating to compact or low specific gravity parts, a nickel film can be uniformly formed thereon. SOLUTION: At the time when barrel plating is performed in such a manner that an oligo-molecular specific compound of fatty alcohols or ethers in which ethylene oxide or propylene oxide unit is repeated by 1 to 4 pieces, and having hydrogen or C<SB>1</SB>to C<SB>4</SB>alkyl radicals or C<SB>1</SB>to C<SB>2</SB>alkyl radicals on both the ends such as 2-methoxy ethanol, diethylene glycol monomethyl ether, dipropylene glycol and 1,2-dimethoxy ethane on both the ends is added to a nickel plating bath, wettability can be improved even to electronic parts largely including compact or low specific gravity parts floating in a plating bath, and the nickel plating film can be uniformly formed thereon. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006037164(A) 申请公布日期 2006.02.09
申请号 JP20040218520 申请日期 2004.07.27
申请人 ISHIHARA CHEM CO LTD 发明人 ORI KEIJI;TSUKABE SUSUMU;FUJIMURA KAZUMASA
分类号 C25D3/12;C25D7/00;C25D17/16 主分类号 C25D3/12
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