| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for encapsulation, whose cured product has restrained moisture absorption, whose cured product has a predetermined coefficient of linear(thermal) expansion at ordinary temperature, and which can afford a device with encapsulated electronic components which excels in solder heat resistance and heat cycle reliability. SOLUTION: The resin composition for encapsulation contains (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as the essential components. In the composition, the content of the inorganic filler (C) to the whole of the encapsulation resin composition is≥85 wt%, the inorganic filler (C) is a mixture of at least one metal hydroxide selected from among aluminum hydroxide and magnesium hydroxide and a fused silica, and the coefficient of linear(thermal) expansion at ordinary temperature of the cured product of the encapsulation resin composition is≥1.1×10<SP>-5</SP>/°C and≤1.5×10<SP>-5</SP>/°C. COPYRIGHT: (C)2006,JPO&NCIPI
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