| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing a piezoelectric resonator which can be miniaturized even if the piezoelectric resonator is housed together with the other electronic component such as a semiconductor element, is excellent in characteristics such as oscillation frequency characteristics of the piezoelectric resonator, and is excellent in the reliability of electric connection to an external electric circuit etc, and to provide a piezoelectric device. <P>SOLUTION: The apparatus is provided with an insulating base 1 having a recess 5 formed on its top surface, a frame 10 formed around the entire periphery of the recess 5 on the top surface of the insulating base 1, a wiring conductor 6 formed from the inside of the frame 10 toward the external surface of the insulating base 1, and a lid 7 attached on the top surface of the insulating base 1 so as to close the recess 5. Piezoelectric resonators 2, 3 and an electronic component 4 are housed in the recess 5, and a semiconductor element 8 is mounted on the top surface of the lid 7. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
