| 摘要 |
The fluid-flow device ( 100 ) of the invention comprises a stack ( 30 ) covered by a closure wafer ( 20 ), said stack ( 30 ) comprising a support wafer ( 36 ), a layer of insulating material ( 34 ), and a silicon layer ( 32 ). The closure wafer ( 20 ) and/or said silicon layer ( 32 ) are machined so as to define a cavity ( 38 ) between said closure wafer ( 20 ) and said silicon layer ( 32 ), said support wafer ( 36 ) has at least one duct ( 102 ) passing right through it, said layer of insulating material ( 34 ) presenting at least one zone ( 35 ) that is entirely free of material placed at least in line with said duct ( 102 ) so as to co-operate with said cavity ( 38 ) to define a moving member ( 40 ) in said silicon layer ( 32 ), the moving member being suitable under the pressure of liquid in said cavity ( 38 ) for reversibly moving towards said support wafer ( 36 ) until contact is made between said moving member ( 40 ) and said support wafer ( 36 ).
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