| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of increasing stress resistance between a semiconductor chip and a lead frame.SOLUTION: The semiconductor device includes a semiconductor chip. The metal part has a concave in a mounting area of the semiconductor chip. The planar shape of the concave part is similar to the planar shape of the semiconductor chip. Viewing from the top of the surface of the semiconductor chip, the center or center of gravity of planar shape of the concave part coincides with the center or center of gravity of the planar shape of the semiconductor chip. A solder is applied to the concave part. The solder is formed between the metal part and the semiconductor chip in the concave part.SELECTED DRAWING: Figure 2 |
