发明名称 |
SEPARATING AND ASSEMBLING SEMICONDUCTOR STRIPS |
摘要 |
<p>A method and an apparatus for separating elongated semiconductor strips (630) from a wafer (400) of semiconductor material are disclosed. Vacuum (500) is applied to the face of each semiconductor strip forming an edge of the wafer (400) or being adjacent to the edge. The wafer (400) and the source of the vacuum (500) are displaced to separate each elongated semiconductor strip (630) from the wafer (400), Further a method and an apparatus for assembling elongated semiconductor strips (630) separated from a wafer (400) of semiconductor material into an array of strips (630) are disclosed. Still further, methods, apparatuses, and systems for assembling an array of elongated semiconductor strips (630) on a substrate are also disclosed.</p> |
申请公布号 |
EP1623458(A1) |
申请公布日期 |
2006.02.08 |
申请号 |
EP20040731535 |
申请日期 |
2004.05.07 |
申请人 |
ORIGIN ENERGY SOLAR PTY LTD. |
发明人 |
WONG, PAUL, CHARLES;ABNOOS, RAZMIK;EVERETT, VERNIE, ALLAN;KERR, MARK, JOHN |
分类号 |
H01L21/00;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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