发明名称 Method for designing wiring connecting section and semiconductor device
摘要 First, an amount of a current flowing between a first wiring (1A) and a second wiring (4A) is estimated, and the number of stack vias required for connecting the first wiring (1A) and the second wiring (4A) is determined. Next, based on the number of stack vias (14), the number of virtual wirings (4B) for determining positions of the stack vias (14) is determined. Thereafter, the virtual wirings (4B) are arranged in a forming region of the second wiring (4A) above the first wiring (1A), for example, at an equal interval, and the stack vias (14) are created in intersections (5) of the first wiring (1A) and the virtual wirings (4B). Thereafter, the virtual wirings (4B) are removed, and the third wiring (4A) may be created. According to needs, a second wiring (2A) passing between the stack vias (14) is created.
申请公布号 EP1291793(A3) 申请公布日期 2006.02.08
申请号 EP20020251877 申请日期 2002.03.15
申请人 FUJITSU LIMITED 发明人 KUMAGAI, KENJI
分类号 G06F17/50;H01L21/82;H01L21/00;H01L23/522 主分类号 G06F17/50
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