| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting electronic components by which the movement distance of a substrate can be shortened and electronic components can be mounted on the board at high speed, when mounting many electronic components on the substrate using a multi-nozzle type mounting head. SOLUTION: A method for mounting electronic components on a substrate wherein, with mounting heads 21-25 with multiple nozzles being index-rotated along a rotary head, electronic components P1-P5 set in a parts feeder are mounted on a substrate 8 which is positioned on an XY table section. The center of gravity G as a reference point is set inside a plurality of the electronic components P1-P5 to be mounted on the substrate 8. And, the distances D1-D5, D1'-D5' between the two rotating positions of the mounting heads 21-25 which can mount the electronic components P1-P5 at specified coordinates positionsand, the center of gravity G which is the reference point, are calculated. Out of the two distances, the shorter one is selected and then the electronic components P1-P5 are mounted. |
