发明名称
摘要 PROBLEM TO BE SOLVED: To obtain a resist material having satisfactory resolving power and sensitivity, a small line edge roughness and superior dry etching resistance by incorporating a high molecular compound comprising a dendric-polymer (dendrimer) or a hyper-branched polymer of a phenol derivative and having a specified weight average molecular weight as a base polymer. SOLUTION: The resist material contains a high molecular compound comprising a dendric-polymer (dendrimer) or a hyper-branched polymer of a phenol derivative and having a weight average molecular weight of 500-10,000,000 as a base polymer. The high molecular compound comprises repeating units of formula I and/or repeating units of formula II and repeating units of formula III. In the formulae I and II, R1 is H or methyl, plural symbols R2 are mutually the same or different and each a 1-30C linear, branched or cyclic alkyl or the like, R3 is OR4, (x) is 0 or a positive integer, (y) is a positive integer and x+y<=5. In the formula III, X is a single bond, branched alkylene or the like.
申请公布号 JP3743491(B2) 申请公布日期 2006.02.08
申请号 JP20000061014 申请日期 2000.03.06
申请人 发明人
分类号 G03F7/039;C08F2/06;C08F212/14;C08J3/24;C08L25/18;G03F7/038;H01L21/027 主分类号 G03F7/039
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