发明名称 |
METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH STACKED ANALOG COMPONENTS IN BACK END OF LINE (BEOL) REGIONS |
摘要 |
A method for making a semiconductor device may include forming a first dielectric layer above a semiconductor substrate, forming a first trench in the first dielectric layer, filling the first trench with electrically conductive material, removing upper portions of the electrically conductive material to define a lower conductive member with a recess thereabove, forming a filler dielectric material in the recess to define a second trench. The method may further include filling the second trench with electrically conductive material to define an upper conductive member, forming a second dielectric layer over the first dielectric layer and upper conductive member, forming a first via through the second dielectric layer and underlying filler dielectric material to the lower conductive member, and forming a second via through the second dielectric layer to the upper conductive member. |
申请公布号 |
US2016254343(A1) |
申请公布日期 |
2016.09.01 |
申请号 |
US201615082987 |
申请日期 |
2016.03.28 |
申请人 |
STMicroelectronics, Inc. |
发明人 |
ZHANG John H. |
分类号 |
H01L49/02;H01L23/528;H01L21/768;H01L23/522 |
主分类号 |
H01L49/02 |
代理机构 |
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代理人 |
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主权项 |
1. A device, comprising:
a substrate; a plurality of active circuit regions in the substrate; a first dielectric layer on the substrate and on the plurality of active circuit regions; a first opening in the first dielectric layer; a first conductive layer in the first opening; a second dielectric layer on the first dielectric layer and on the first conducive layer in the first opening; a second opening in the second dielectric layer; a second conductive layer in the second opening; and a third dielectric layer on the second dielectric layer and on the second conductive layer, the first conductive layer being separated from the third dielectric layer by the second dielectric layer. |
地址 |
Coppell TX US |