发明名称 METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH STACKED ANALOG COMPONENTS IN BACK END OF LINE (BEOL) REGIONS
摘要 A method for making a semiconductor device may include forming a first dielectric layer above a semiconductor substrate, forming a first trench in the first dielectric layer, filling the first trench with electrically conductive material, removing upper portions of the electrically conductive material to define a lower conductive member with a recess thereabove, forming a filler dielectric material in the recess to define a second trench. The method may further include filling the second trench with electrically conductive material to define an upper conductive member, forming a second dielectric layer over the first dielectric layer and upper conductive member, forming a first via through the second dielectric layer and underlying filler dielectric material to the lower conductive member, and forming a second via through the second dielectric layer to the upper conductive member.
申请公布号 US2016254343(A1) 申请公布日期 2016.09.01
申请号 US201615082987 申请日期 2016.03.28
申请人 STMicroelectronics, Inc. 发明人 ZHANG John H.
分类号 H01L49/02;H01L23/528;H01L21/768;H01L23/522 主分类号 H01L49/02
代理机构 代理人
主权项 1. A device, comprising: a substrate; a plurality of active circuit regions in the substrate; a first dielectric layer on the substrate and on the plurality of active circuit regions; a first opening in the first dielectric layer; a first conductive layer in the first opening; a second dielectric layer on the first dielectric layer and on the first conducive layer in the first opening; a second opening in the second dielectric layer; a second conductive layer in the second opening; and a third dielectric layer on the second dielectric layer and on the second conductive layer, the first conductive layer being separated from the third dielectric layer by the second dielectric layer.
地址 Coppell TX US