| 发明名称 |
ADHESIVE RESIN COMPOSITION AND ADHESIVE AGENT IN FILM FORM, AND SEMICONDUCTOR DEVICE USING THE SAME |
| 摘要 |
<p>The present invention is to provide an adhesive resin composition for use in preparing an adhesive in the form of a film which is excellent in the adhesiveness at a low temperature and in the heat resistance, an adhesive in the form of a film comprising the adhesive resin composition, and a semiconductor device using the adhesive in the form of a film.</p> |
| 申请公布号 |
EP1624038(A1) |
申请公布日期 |
2006.02.08 |
| 申请号 |
EP20040727117 |
申请日期 |
2004.04.13 |
| 申请人 |
MITSUI CHEMICALS, INC. |
发明人 |
KODAMA, YOUICHI;MARUYAMA, HIROSHI;NARUSE, ISAO |
| 分类号 |
C08L63/00;C09J7/00;C09J7/02;C09J179/08;H01L21/58;(IPC1-7):C09J179/08;H01L21/52 |
主分类号 |
C08L63/00 |
| 代理机构 |
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