THERMAL-EXPANSION ADJUSTING AGENT, USAGE AS THERMAL-EXPANSION ADJUSTING AGENT, THERMOSETTING RESIN COMPOSITION, INSULATING MATERIAL, SEALANT, AND CONDUCTIVE PASTE CONTAINING SAID THERMOSETTING RESIN COMPOSITION, HARDENED MATERIAL OBTAINED BY HARDENING SAID THERMOSETTING RESIN COMPOSITION, SUBSTRATE MATERIAL HAVING SAID THERMOSETTING RESIN COMPOSITION, PREPREG IN WHICH BASE MATERIAL THEREOF IS IMPREGNATED WITH SAID THERMOSETTING RESIN COMPOSITION, MEMBER IN WHICH SAID THERMOSETTING RESIN COMPOSITION OF SAID PREPREG IS HARDENED, THERMAL-EXPANSION-RATE ADJUSTING METHOD, AND MEMBER MANUFACTURED BY USING SAID ADJUSTING METHOD

摘要

A thermal-expansion adjusting agent containing a glycoluril derivative compound of formula (1) is provided so as to serve as a thermal-expansion adjusting agent with which it is possible to reduce the linear thermal expansion coefficient of a hardened material of a thermosetting resin composition employed in an insulation resin layer or the like, and which is effective for suppressing deformation of a circuit substrate due to heating; and, because it is possible to reduce the linear thermal expansion coefficient of the hardened material, which is obtained by hardening the thermosetting resin composition, by combining the thermal-expansion adjusting agent, it is possible to provide a member that exhibits low deformation due to heat.