发明名称 |
PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME |
摘要 |
<p>A photocurable and thermosetting composition for an ink jet system comprises (A) a monomer having a (meth)acryloyl group and a thermosetting functional group in its molecule, (B) a photoreactive diluent having a weight-average molecular weight of not more than 700 other than the component (A) mentioned above, and (C) a photopolymerization initiator and has a viscosity of not more than 150 mPa·s at 25°C. A solder resist pattern is directly drawn on a printed circuit board by means of an ink jet printer using the above-mentioned composition, and the pattern is primarily cured by irradiation with an active energy ray and then further cured by heating.</p> |
申请公布号 |
EP1624001(A1) |
申请公布日期 |
2006.02.08 |
申请号 |
EP20040731714 |
申请日期 |
2004.05.07 |
申请人 |
TAIYO INK MANUFACTURING CO. LTD |
发明人 |
KAKINUMA, M.,;KUSAMA, M.,;USHIKI, S., |
分类号 |
B41M5/00;C08F2/00;C08F2/46;C08F10/00;C08F20/00;C09D11/00;C09D11/322;C09D11/324;C09D11/38;H05K3/28;(IPC1-7):C08F220/10 |
主分类号 |
B41M5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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