发明名称 |
Integrated chip package having intermediate substrate and multiple semiconductor chips |
摘要 |
The present integrated chip package provides a low cost package that is suitable for high density semiconductors that have high power dissipation. The integrated chip package includes at least one semiconductor chip having a first surface and a second surface. The first surface of the semiconductor chip is electrically coupled to an intermediate substrate via conductive bumps. The intermediate substrate is also electrically coupled to a package substrate via a plurality of bonding wires. The second surface of the semiconductor chip is thermally coupled to a heat sink to increase the power dissipation capacity of the integrated chip package.
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申请公布号 |
US6995463(B1) |
申请公布日期 |
2006.02.07 |
申请号 |
US20030346428 |
申请日期 |
2003.01.16 |
申请人 |
MARVELL INTERNATIONAL LTD. |
发明人 |
SUTARDJA SEHAT |
分类号 |
H01L23/48;H01L23/02;H01L23/24;H01L23/367;H01L23/498;H01L23/50;H01L25/065;H01L25/16 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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