发明名称 |
Resin composition with high thermal conductivity and method of producing the same |
摘要 |
A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.
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申请公布号 |
US6995205(B2) |
申请公布日期 |
2006.02.07 |
申请号 |
US20040490629 |
申请日期 |
2004.03.25 |
申请人 |
OSAKA MUNICIPAL GOVERNMENT |
发明人 |
MATSUKAWA KIYOTAKA;ISHIHARA KOZO;KAMIYAHATA TSUNEO;INADA YOSHIKAZU;AGARI YASUYUKI;SHIMADA MASAYUKI |
分类号 |
C08J3/00;C08K3/04;C08K3/08;C08L61/00;C08L77/00;F04D29/02;F04D29/58;G11B7/085 |
主分类号 |
C08J3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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