| 摘要 |
<p>A method and apparatus are provided for electrostatically applying a coating, such as solder mask, to a substrate such as a circuit board. A grounded conveyor system includes electrically conductive means for suspending the substrate from the conveyor and grounding the substrate. An atomizing spray nozzle provides an atomized, electrically charged spray of the coating material in the direction of the grounded substrate. A focusing element is positioned to confine the spray to a desired pattern, and a receiving backplate, which carries a charge opposite that of the spray, is positioned behind the substrate to attract the charged coating particles that do not impinge on the substrate.</p> |
