| 摘要 |
PROBLEM TO BE SOLVED: To provide a component packaging structure and a method in which an electrical connection is ensured and productivity is improved. SOLUTION: A spot facing centrifugal with a component hole is provided on a component surface, and cream solder is loaded into the spot facing in the case of solder printing. A solder is then formed in a void between the lead of a lead component and the spot facing by reflow processing, and the lead component is fixed on a substrate through the same steps as other packaging components. Thus, local soldering of the lead is eliminated to improve productivity of the substrate. Furthermore, an electrical connection of the lead is ensured by the solder formed in the spot facing. COPYRIGHT: (C)2006,JPO&NCIPI
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