发明名称 |
Methods for forming wiring and electrode |
摘要 |
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively.
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申请公布号 |
US2006024937(A1) |
申请公布日期 |
2006.02.02 |
申请号 |
US20050237869 |
申请日期 |
2005.09.29 |
申请人 |
INTERNATIONAL CENTER FOR MATERIALS RESEARCH |
发明人 |
YOKOYAMA YASUAKI;YONEKURA ISAMU;SATOH TAKASHI;WAKASAKI TAMAKI;TAKEUCHI YASUMASA;ENDO MASAYUKI |
分类号 |
H01L21/3205;C23C18/02;C23C18/14;H01L21/288;H01L21/4763 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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