| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a thin CSP substrate, without causing voids to be generated in resin or a wire bonded to a semiconductor chip to be exposed. <P>SOLUTION: A mold die 5 is put on the upper part of the plurality of semiconductor chips C, the plurality of semiconductor chips C are sealed with resin and formed into a planar shape by injecting the resin 6 inside the die; and after the resin has solidified, the upper surface of the resin 6 is polished and polishing is ended, before a polishing surface reaches the top of a semiconductor device D1. Since the resin is polished after resin sealing, the amount of the resin to be injected to the die is not limited; and by injecting sufficient amount of the resin, void will not be generated, and the wire 3 bonded to the semiconductor chips C will not expose either. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
