| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve such a problem that, since the adhesive force of electronic parts is insufficient in the conventional mounting method for the electronic parts, a mounting area tends to be made larger and the electronic part is apt to displace in the mounting phase, and it is difficult to make a substrate thin. <P>SOLUTION: The substrate is provided with a conductive electrode for connecting electronic parts and it is used for mounting the electronic parts. In this case, the shape of at least one conductive electrode is nearly the same shape as one section of the electronic parts to be mounted inside. The electronic part is connected to the substrate by using a conductive adhesive agent. Furthermore, the electronic part is placed inside the conductive electrode, and the electronic part and the conductive electrode are arranged side by side on the substrate. In addition, the conductive adhesive agent is applied to the inside of the conductive electrode, and the electronic part is mounted thereon. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
