| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of forming piezoelectric film by which the thickness unevenness of a piezoelectric film is reduced. <P>SOLUTION: The piezoelectric film 30 is formed by scanning a plurality of times while an injection nozzle 22 is shifted in the crossing direction and, at the same time, making adjacent deposited layers 31 to partially overlap each other. In addition, the moving distance of the injection nozzle 22 in the crossing direction is decided on the basis of the thickness distribution of the deposited layers 31. Moreover, the deposited layer 31 constituting a first piezoelectric layer 32 is shifted in the crossing direction with respect to the deposited layer 31 constituting a second piezoelectric layer 33 laid upon the deposited layer 31 constituting the first piezoelectric layer 32. Consequently, the thickness of a piezoelectric film 30 is uniformized as a whole by adjusting the overlapping rate of the deposited layers 31 so that areas having small adhering amounts of particles 2 may overlap each other. In addition, the cost is reduced, because it is not required to increase the size of the device. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
