| 摘要 |
PROBLEM TO BE SOLVED: To prevent the frequency characteristics of a high-frequency module from deteriorating by miniaturization. SOLUTION: The high-frequency module 1 comprises 14 terminals T1-T14, a diplexer 2, two high-frequency switches 3, 5, a low-pass filter 4, and a multilayer board for integrating them. The high-frequency switch 3 selectively connects the terminals T8, T12, T13 to the terminal T10. A diode 17 is inserted into a signal path for connecting the terminal T8 to the terminal T10. The terminal T9 into which a control signal Vc 1 for controlling the diode 17 is input is connected to the anode of the diode 17 via an inductor 18. The inductor 18 is connected to the terminal T9 by bypassing a conductive layer inside the multilayer board. COPYRIGHT: (C)2006,JPO&NCIPI
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