| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed board mounted component which can be mounted on a printed board in a designed attitude as much as possible. SOLUTION: The mounted component is mounted on the printed board. When mounted, the mounted component is set on fused solder. The flat surface of the mounted component is received by the fused solder. The fused solder makes the mounted board buoyant because of the surface tension of the fused solder. An annular groove is cut in the flat surface. The mounted component in the buoyancy state is at a stable attitude through the annular groove. Consequently, the mounted component can be mounted on the printed board in the designed attitude. COPYRIGHT: (C)2006,JPO&NCIPI
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