| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing at low cost and in a short time a practically withstanding phenolic resin foam in terms of thermal insulation performance, dimensional change (nonshrinkage) and mechanical strength, etc., suppressed in cell wall damage which may occur on undergoing postcure and free of bursting, blistering and/or shrinkage. SOLUTION: The method for producing the phenolic resin foam comprises the following process: A primary foam obtained by expanding and curing an expandable phenolic resin molding compound comprising (A) a resol-type phenolic resin, (B) a surfactant, (C) at least one foaming agent selected from a 3-7C aliphatic hydrocarbon compound, 5-7C alicyclic hydrocarbon compound and 1-5C chlorinated aliphatic hydrocarbon compound and (D) a curing agent is subjected to postcure treatment at 80-90°C in a single-structured curing hot oven. The phenolic resin foam thus produced has a dimensional change percentage of less than 1% and a compressive strength of≥14.0 N/cm<SP>2</SP>at 30 mm thickness. COPYRIGHT: (C)2006,JPO&NCIPI |
