| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for plating electronic components for applying good plating at a good yield to the electronic components by suppressing and preventing occurrence of an adhesion defect of the cohesion of the electronic components to each other, and degradation in uniformity of plating films even when the plating is applied to the small-sized electronic components, and a method for manufacturing the electronic components using the method for plating electronic components. SOLUTION: The electronic component (laminated ceramic capacitors) 10 has an approximately rectangular parallelepipe shape of 0.6 mm in length (L), 0.3 mm in width (W) and 0.3 mm in height (T), and in this case, as media 11 for current passage, the media of approximately spherical shapes having a diameter of 0.9 to 1.1 times of the shortest side size of the electronic component are used. Also, the plating is performed by further adding approximately spherical insulative granule (medium for agitation) 12 for loosening thereto. COPYRIGHT: (C)2006,JPO&NCIPI
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