发明名称 |
DIP MOLDING COMPOSITION FOR GLUING POLYURETHANE, AND SOLVENT PASTE |
摘要 |
PROBLEM TO BE SOLVED: To provide a dip molding composition for gluing polyurethane excellent particularly in adhesive properties to polyurethane and excellent also in flexibility and insulating properties, and a solvent paste. SOLUTION: The dipping composition for gluing polyurethane comprises an isobutylene block copolymer constituted of an isobutylene compound block and an aromatic vinyl compound block and selectively contains at least (b) 1-80 pts. wt. of a hydrogenated and/or a partially hydrogenated copolymer, (c) 1-100 pts. wt. of a non-aromatic softening agent for a rubber or (d) 1-50 pts. wt. of a petroleum resin. A composition obtained by dissolving the composition in 80-400 pts. wt. of a solvent and the solvent paste are also provided. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006028383(A) |
申请公布日期 |
2006.02.02 |
申请号 |
JP20040211154 |
申请日期 |
2004.07.20 |
申请人 |
RIKEN TECHNOS CORP;SANKEI KOGYO KK |
发明人 |
TASAKA MICHIHISA;NAKAMURA SADAYUKI |
分类号 |
C08L53/02;C08L91/00;C08L99/00 |
主分类号 |
C08L53/02 |
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