发明名称 DIP MOLDING COMPOSITION FOR GLUING POLYURETHANE, AND SOLVENT PASTE
摘要 PROBLEM TO BE SOLVED: To provide a dip molding composition for gluing polyurethane excellent particularly in adhesive properties to polyurethane and excellent also in flexibility and insulating properties, and a solvent paste. SOLUTION: The dipping composition for gluing polyurethane comprises an isobutylene block copolymer constituted of an isobutylene compound block and an aromatic vinyl compound block and selectively contains at least (b) 1-80 pts. wt. of a hydrogenated and/or a partially hydrogenated copolymer, (c) 1-100 pts. wt. of a non-aromatic softening agent for a rubber or (d) 1-50 pts. wt. of a petroleum resin. A composition obtained by dissolving the composition in 80-400 pts. wt. of a solvent and the solvent paste are also provided. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006028383(A) 申请公布日期 2006.02.02
申请号 JP20040211154 申请日期 2004.07.20
申请人 RIKEN TECHNOS CORP;SANKEI KOGYO KK 发明人 TASAKA MICHIHISA;NAKAMURA SADAYUKI
分类号 C08L53/02;C08L91/00;C08L99/00 主分类号 C08L53/02
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