| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems wherein good sealing properties are required because dust, moisture or the like can be the cause of obstacles in equipment, installations or the like adopted in home equipment, a vehicle or the like wherein the one equipped with an electronic component and having high performance recently tends to be adopted, and the problems wherein a sealing material such as a silicone resin is inconvenient because the sealing material does not have disassembly properties because of being fixed although having the sealing properties, because sometimes the disassembly properties and reassembly properties are required for taking out the electronic component at the obstacle and reassembling the disassembled component. SOLUTION: The hotmelt composition obtained by compounding a hydrogenated paraffin oil, a styrenic block copolymer, a (modified) polyphenylene ether resin, an adhesion-imparting resin and an antioxidant is utilized for various kinds of the equipment, devices and components. COPYRIGHT: (C)2006,JPO&NCIPI
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