| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition excellent in light-shielding property and reliability and useful particularly for semiconductor devices having a light-receiving part such as a digital camera, a light-shielding material composed of a cured product of the composition, and a semiconductor device sealed with the cured product of the composition. SOLUTION: The liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) a curing accelerator, and (C) 10-40 mass%, based on the whole composition, of a carbon powder bearing a hydroxy group and a carboxy group on the particle surface and having a BET specific surface area of 100-200 m<SP>2</SP>/g where the content of particles having a particle size of at least 75μm is at most 1 mass% based on the whole amount of the carbon powder. The light-shielding material is composed of the cured product of the composition. The semiconductor device sealed with the cured product of the composition is also provided. COPYRIGHT: (C)2006,JPO&NCIPI
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