发明名称 ANTISTATIC RESIN SHEET AND MOLDED ARTICLE FOR ELECTRONIC COMPONENT PACKAGING
摘要 PROBLEM TO BE SOLVED: To provide a laminated sheet which has high adhesion between its substrate sheet and conductive coating layer and can prevent a degradation in antistatic properties due to exfoliation or fracture of the coating layer. SOLUTION: An antistatic laminated sheet is prepared: wherein the laminated sheet comprises a coating layer of a conductive polymer soluble in an aqueous solvent, which is formed on at least one surface of a thermoplastic resin substrate sheet; and wherein the surface of the substrate sheet shows a contact angle of 50-85°to water. The thermoplastic resin can be a polystyrenic resin which has at least one acrylic monomer selected from (meth)acrylic acid, (meth)acrylic ester and (meth)acrylonitrile as its building block, for example, a transparent rubber modified polystyrenic resin having a (meth)acrylic alkyl ester as its building block. The conductive polymer can be composed of at least a polythiophene polymer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006027266(A) 申请公布日期 2006.02.02
申请号 JP20050173202 申请日期 2005.06.14
申请人 DAICEL POLYMER LTD 发明人 OKUMURA YASUO
分类号 B32B27/00 主分类号 B32B27/00
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