发明名称 Electronic component mounting apparatus
摘要 The invention is directed to performing electronic component mounting operations by the suction nozzles of the mounting heads in each of the plurality of the rotary tables independently, moving each of the positioning tables for positioning a printed board in a component mounting position independently, and performing the electronic component mounting operation on the plurality of the printed boards independently. A component feeding device moves a plurality of component feeding tables having a plurality of component feeding units in an arraying direction thereof respectively and independently. Mounting heads having a plurality of suction nozzles for picking up electronic components from the component feeding devices respectively are provided at predetermined intervals corresponding to intermittent pitches on an outer circumference of two rotary tables intermittently rotating. Therefore, the suction nozzle of the mounting head of each of the rotary tables picks up the electronic component fed to a component pickup position in each of the component feeding units set on each of the component feeding tables, and mounts the component on the printed board on the corresponding XY table.
申请公布号 US2006021215(A1) 申请公布日期 2006.02.02
申请号 US20050192431 申请日期 2005.07.29
申请人 HITACHI HIGH-TECH INSTRUMENTS CO., LTD. 发明人 KANO YOSHINORI;USUI YOSHINAO;TAKEMURA IKUO;MORIYA YUJI;YAMAGUCHI HARUHIKO;OKAMOTO MANABU;IZUHARA KOICHI;KURATA KENJI;ASAI JUN
分类号 B23P19/00 主分类号 B23P19/00
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